FPCB Lamination

Temperature Logger Smart Card

FPCB Lamination-003 · FPCB Lamination

The Temperature Logger Smart Card (FPCB Lamination-003) integrates advanced FPCB lamination technology with the NXP NHS3100 chip, delivering precise temperature logging capabilities within a compact, durable form factor. Designed for…

Product Overview

The Temperature Logger Smart Card (FPCB Lamination-003) integrates advanced FPCB lamination technology with the NXP NHS3100 chip, delivering precise temperature logging capabilities within a compact, durable form factor. Designed for demanding environments, this smart card ensures reliable performance with its IP67 rating and robust material composition.

Ideal for physical access credential applications, this product combines high-frequency communication with temperature monitoring, providing a versatile solution for industries requiring secure and environmental-aware identification.

Technical Specifications

Product Identity

SKU / Model Number
FPCB Lamination-003
Part Number
FPCB Lamination-003

Classification

Business Unit
IDM
Sub BU
Others
Industry Category
Physical Access Credential
Core Technology
FPCB Lamination

RFID & Electronics

Chip Type
NXP NHS3100
Frequency
HF

Physical Construction

Size
85.6x54x0.84mm
Material
PVC; PET

Environmental & Durability

Storage Temperature
-10 ℃ ~ +50 ℃
Operating Temperature
-10 ℃ ~ +50 ℃
IP Rating
IP67

Application & Market Fit

Applications
Others
Company Information

Sustainability & Traceability

SES RFID Solutions designs and manufactures RFID tag hardware. This page covers our certifications, quality practices, and where our tags are used in traceability and sustainabili…

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