FPCB Lamination

Fingerprint + E Paper

FPCB Lamination-004 · FPCB Lamination

The Fingerprint + E Paper credential combines advanced biometric authentication with flexible electronic paper display technology, optimized for secure physical access control. Utilizing FPCB Lamination and HF chip compatibility, this…

Product Overview

The Fingerprint + E Paper credential combines advanced biometric authentication with flexible electronic paper display technology, optimized for secure physical access control. Utilizing FPCB Lamination and HF chip compatibility, this credential delivers reliable performance in demanding environments.

Technical Specifications

Product Identity

SKU / Model Number
FPCB Lamination-004
Part Number
FPCB Lamination-004

Classification

Business Unit
IDM
Sub BU
Biometric
Industry Category
Physical Access Credential
Core Technology
FPCB Lamination

RFID & Electronics

Chip Type
HF(NXP,ST,Infineon,SONY,Legic)
Frequency
HF

Physical Construction

Size
85.6x54x0.84mm
Material
PVC; PET

Environmental & Durability

Storage Temperature
-10 ℃ ~ +50 ℃
Operating Temperature
-10 ℃ ~ +50 ℃
IP Rating
IP67

Application & Market Fit

Applications
MoC
Company Information

Sustainability & Traceability

SES RFID Solutions designs and manufactures RFID tag hardware. This page covers our certifications, quality practices, and where our tags are used in traceability and sustainabili…

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